Job Description
1. Manages production support engineering for a specific product or group of products after transfer from design to high volume production.
2. Responsible for wafer level / package level test program enhancement & change buy-off.
3. Responsible for Failure Analysis & test program debug to provide solution for product yield improvement to meet yield and quality target, and special material disposition.
4. Sustains products to be competitive with cost reduction, throughput enhancement, quality improvement and yield improvements, through process/test program fine tune, failure analysis, data analysis, and with leveraging experiment or volume data of production.
Requirement
1.Master degree in Microelectronics, Electrical Engineering, Computer Science or equivalent；
2.Have knowledge on memory product, NAND/NOR or RAM is a plus.
3.C/C++/Java programming skills on Windows/Linux Platform, Scripting and Database knowledge is a plus.
4.Experience with hardware debugging tools such as multi-meters and logical analyzers is a plus.
5.Self-motivated and willing to learn.
6.Excellent English communication (written and verbal) and interpersonal skills.
7.Ability to troubleshoot, analyze complex problems, multi-task and meet deadlines.
8.Good teamwork, willing to learn, logical thinking and pressure taken.