岗位职责：
1.深入研究失效分析的基本理论，研究常见器件(IC)的失效机制；导入新的实验手段和设备，建立并完善失效分析流程和逻辑;
2、负责产品质量异常IC的失效分析,主要包括封装缺陷、客户退货等重要case等，以确保最快时间内解决生产线上遇到的问题 ；
3、对综合分析结果进行针对性验证，确保失效机理无误，为产品的工艺和设计改进提供参考。
4、建立PKG level和Die level的三维仿真模型，包括模流，银胶/DAF应力，产品结构应力，热力分布等，并验证其准确性，确保能够辅助封装产品及工艺设计，指导异常改善方向。
5、及时高效地完成领导安排的其他任务。
任职要求：
1.博士，理工科、工程力学、材料、化学相关专业；
2. 具备基础仿真能力。
3.了解存储芯片的生产制造工艺流程，了解晶圆制程知识，具备一定Device知识优先；熟悉半导体封装测试的流程及相关失效模式;
4.熟悉失效分析流程及各种失效分析技术，深刻理解各种分析设备及基本原理，包括但不限于Cross section、SAT、X-RAY、Decap、Delayer、SEM、FIB、TEM、Thermal EMMI等；
5.有一定存储芯片失效分析分析经验,有Fab、第三方实验室相关工作经验优先,有国际大厂工作经验为佳;
6.良好的沟通表达能力和抗压能；较强的逻辑思维能力。
Job description：
1.Deeply study the basic theory of failure analysis, study the failure mechanism of common devices (IC).Introduce new FA method and equipment,establish and improve the FA process and logic.
2. Responsible for failure analysis of IC with quality issue, including packaging defects, customer returns and other important cases, so as to ensure that the problems encountered in the production line can be solved as soon as possible.
3. To verify the results of comprehensive analysis and ensure that the failure mechanism is correct, so as to provide reference for the improvement of product process and design.
4. Establish 3D simulation models for both PKG level and Die level, including mold flow, stress in silver glue/DAF, product structural stress, thermal distribution, etc. Verify their accuracy to ensure they can assist in packaging product and process design, guiding the direction of improvement for any anomalies.
5. Complete other tasks assigned by leaders in a timely and efficient manner.
Qualifications required：
1. Bachelor degree or above, majors in science and engineering, engineering mechanics, materials, chemistry and related fields;
2. Possess basic simulation capabilities.
3. Understand the manufacturing process of memory and wafer process knowledge, and device knowledge is preferred.Familiar with semiconductor packaging test process and related failure modes.
4. Be familiar with FA process and various FA technologies, and deeply understand FA equipments and basic principles, including but not limited to Cross Section, SAT, X-Ray, Decap, Delayer, SEM, FIB, TEM, Thermal EMMI, etc..
5. Have some experience in memory IC failure analysis, relevant working experience in Fab and third-party laboratory is preferred, and experienced in global famous factory is preferred.
6. Good communication skills and pressure resistance,strong logical thinking ability.