POSITION OVERVIEW:
The role is responsible to sucessfully lead process development for advanced IGBT/FRD technologies in internal or external foundries. Interface with the various developments regarding to chip technology and foundry process platform need.
KEY RESPONSIBILITIES:
61Familiar with IGBT/FRD technology development, from R&D to mass production
61Responsible for developing the latest process technology according to the new platform or new product needs
61Responsible for defining or developing test structures and defining the test specifications needed to monitor and characterize the manufacturing process
61Accountable for setting up an appropriate process monitoring (inline, PCM), specifications and reporting thereof (cp/cpk)
61Execute major process development or integration tasks and build up product and process knowledge.
61Leader of medium size process integration or optimization projects.
61Sub-project leader of process development or integration tasks in complex projects.
61Technical documents preparation, process change notice, etc.
61Build up and maintain knowledge (technical & procedures) and BG internal & external contacts in own field of expertise.
61Provide technical mentorship to team members when needed.
SKILLS/COMPETENCIES
(Top 3-7 most important/critical competencies needed for the job both soft and hard skills):
61Understand IGBT principles.
61Profound knowledge of semiconductor process technologies,
61Hands on experience in process integration or process development for high power devices,
61Experienced in discrete IGBT and their specific needs in small form factor.
61Experienced in thin wafer technology, substrate definition, backside metallization schemes etc. 12” experiences is a plus
61Major in Microelectronics, master’s degree with 8 years’ experience
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Nexperia is an Equal Opportunity/Affirmative Action Employer.
职位要求：
Same as above.
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