Requirements:
61 Provide support during H2H collaborations. beta projects. and gap analysis.
61 Contribute to wafer test plan development for engagement projects with division
61 Execute detailed customer wafer characterization with min11nal supervision;
61 Respond to customer requests and perform routine to moderately complex problem diagnosis and problem resolution:
61 Document technical solution and create best known methods (BKMs) on supported products:
61 Lead preparation and demonstration of products to the customer base:
61 Provide advanced operational training to customers
Qualifications:
61 MS/BS with 1-3 years experience or equivalent combination of education and experience 1n engineering applications
61 Proficient in computer applications for data presentation and analysis:
61 Ability to effectively convey ideas through oral and written communications;
61 Proficient in the English language.
61 Ability to multitask in a constantly changing work environment:
61 Responsible working attitude and should be a team player;
61 Good working knowledge (implies understanding as well as the ability to apply theories and concepts in variant of circumstances) of customer processing knowledge;
61 Good working knowledge of various applications·
61 Ability to diagnose and resolve basic customer issues;
61 Strong communication skills especially technical writing skills,
61 IC Fab process development experience is a plus
61 Knowledge in defect detection. metrology, process control and yield management is a plus.