岗位职责：
61 Process Technology Development:
89 Develop, qualify, and optimize sawing/singulation processes (mechanical dicing, laser dicing, stealth dicing) for NAND Flash packaging (e.g., BGA, CSP, HBM, HBF, multi-die stacks product…).
89 Investigate new blade materials, dicing parameters, and sawing technologies to minimize chipping, cracking, delamination and other mechanical challenges.
89 Collaborate with material suppliers & equipment vendors to evaluate next-generation dicing solutions.
61 Module Excellence:
89 Resolve critical technical challenges & address critical defects (chipping, burrs, cracks, street residuals…) by using innovation & breakthrough ideas.
89 Drive optimization of process flows, parameter, material, and DFM enhancements.
89 Conduct DOE (Design of Experiments) to refine process parameters (spindle speed, feed rate, blade type, power …) for high process capability & high product performance.
61 New Process/Product Introduction:
89 Lead new process setup and oversee technical reviews during NPI phases to ensure rapid ramp-up to high-volume production.
89 Phase review management to ensure new product/process on schedule delivery.
89 Contribute to advanced packaging roadmaps (e.g., thinner dies, higher die counts, 3D NAND integration, HBM, HBF…).
教育背景Education
Master’s degree in Electrical Engineering, Material Science, Mechanical Design Engineering, Physics and
Chemistry Engineering, or other simi-conductor related field.
知识Knowledge
*职位要求的信息或知识范围 Statement of the Informational or conceptual framework required by the Job
61 Be familiar with the process flow of NAND packaging, including but not limited to the process requirements and machine settings of sawing/singulation processes.
61 Demonstrated proficiency in utilizing diverse quality management methodologies and advanced data analysis software solutions.
61 Candidates with semiconductor fabrication (Fab) or advanced packaging experience are strongly preferred, with demonstrated understanding of key advanced packaging technologies including TSV, TC-NCF, MR-MUF, micro bumping and interposer.
61 Preference will be given to applicants with hands-on experience in HBM and HBF technologies.
相关工作经验Experiences
61 3+ years of experience in semiconductor assembly process/product engineering or other related.
61 Strong knowledge of assembly processes (especially on sawing/singulation related).
61 Experience in new product or process technology development is a plus.
其他胜任力Competencies & Soft Skill
61 MDI - Mindset of Disruptive Innovation
61 Good English skill, both written and oral
61 Strong self-learning motivation, and excellent communication and teamwork skills.
61 Knowledge of Lean Manufacturing/Six Sigma is a plus.
61 Experience in automation/intelligent manufacturing is a plus.