岗位职责：
Process Technology Development:
1 Develop, qualify, and optimize Solder Ball Attach (SBA) processes (e.g., ball placement, reflow, flux cleaning…) for advanced packaging (e.g., BGA, CSP, WLCSP, HBM, HBF…)
2 Investigate new solder materials (e.g., lead-free alloys, low-temperature solders) and processes to improve joint reliability and thermal performance.
3 Collaborate with material suppliers and equipment vendors to evaluate next-generation solutions (e.g., micro-bumping, laser-assisted bonding).
4 Resolve critical technical challenges & address critical defects (ball missing, ball damage, bridging, voids…) by using innovation & breakthrough ideas.
5 Drive optimization of process flows, parameter, material, and DFM enhancements.
6 Lead new process setup and oversee technical reviews during NPI phases to ensure rapid ramp-up to high-volume production.
7 Phase review management to ensure new product/process on schedule delivery.
8 Contribute to advanced packaging roadmaps (e.g., thinner dies, higher die counts, 3D NAND integration, HBM, HBF…).
岗位要求：
教育背景Education
1 Master’s degree in Electrical Engineering, Material Science, Mechanical Design Engineering, Physics and Chemistry Engineering, or other simi-conductor related field
相关工作经验Experiences
2 2+ years of experience in semiconductor assembly process/product engineering or other related.
3 Experience in new product or process technology development is a plus.
4 Good English skill, both written and oral
5 Strong self-learning motivation, and excellent communication and teamwork skills.
6 Knowledge of Lean Manufacturing/Six Sigma is a plus.
7 Experience in automation/intelligent manufacturing is a plus.